Thermal dissipation media for high power electronic devices using a carbon nanotube-based composite

Hung Thang Bui, Van Chuc Nguyen, Van Trinh Pham, Thi Thanh Tam Ngo and Ngoc Minh Phan

Abstract

Challenges in the thermal dissipation of an electronic package arise from the continuous increase in power density of higher-power devices. Carbon nanotubes (CNTs) are known as the highest thermal conductivity material (2000 W mK⁻¹). This excellent thermal property suggests an approach in applying the CNTs in thermal dispersion materials to solve the aforementioned problems. In this work, we present an effect of thermal dissipation of the CNTs in the high-brightness light emitting diode (HB-LED) and micro-processor. For the thermal dissipation of the HB-LED, a vertically aligned carbon nanotube (VA-CNT) film on a Cu substrate was applied. Meanwhile, for the thermal dissipation of a micro-processor, the composite of commercial thermal paste/CNTs was used instead of the VA-CNTs. The experimental and simulation results have confirmed the advantages of the VA-CNT film and thermal paste/CNT composite as excellent thermal dissipation media for HB-LEDs, μ-processors and other high power electronic devices